QianLi ToolPlus BMW330 iPhone 7 Power Logic Module BGA
Stencil professionale di alta precisione.
QianLi ToolPlus S320 iPhone 7 Communication Base Band BGA
Stencil professionale di alta precisione.
Stencil per reballing scheda madre PS4 , kit composto da 2pz
1 PS4 CXD90026G 0.55MM
1 PS4 CDX90044GB 0.55MM
ApprofondisciStencil BGA per console PS3 ( 4 pezzi )
il Kit comprende :
1 PS3 GPU BGA reball stencil( 0.6mm solder balls)
1 PS3 CPU BGA reball stencil(0.6mm solder balls) New
1 PS3 CPU BGA reball stencil(0.6mm solder balls) Old
1 PS3 CXR714120(0.6mm solder balls)
Griglia per reballing GPU CPU CSP CACHE HANA xbox360 ( 5 pz )
il Kit Comprende :
1 XBOX360/DDR3 Cache Heat Directly BGA reball stencil( 0.45mm solder balls)
1 XBOX 360 GPU Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 CPU Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 Southbridge Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 HANA Heat Directly BGA reball stencil( 0.6mm solder balls)
ApprofondisciStencil per reballing CPU Nintendo Switch
dimensioni 52x60mm
palline di stagno : 0.20mm
ApprofondisciStencil per reballing IC nintendo Switch
NFCBEA
BCM4354
MAX77620A
CYW20734UA
BGA200
MAX77812
ApprofondisciFlussante Originale AMTECH NC-559-AS , ottimo per Rework / Reflow su console.
Volume : 10cc
MADE IN USA
Confezione con lotto di produzione e data di scadenza.
Approfondisci