JIG per Reballing D-GOLD WN8090 , compatibile con stencil 80x80 90x90
Caratteristiche :
Struttura in lega di alluminio , per una durata maggiore.
alta precisione di regolazione.
magnete all'interno.
Approfondisci
Stencil per reballing IC nintendo Switch
NFCBEA
BCM4354
MAX77620A
CYW20734UA
BGA200
MAX77812
ApprofondisciStencil per reballing CPU Nintendo Switch
dimensioni 52x60mm
palline di stagno : 0.20mm
ApprofondisciStencil per reballing GPU CPU Hana DDR3 xbox 360 , non direct heat
il kit comprende :
XBOX360/DDR3 Cache BGA reball stencil ( 0.45mm solder balls)*1
XBOX 360 GPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 CPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 Southbridge BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 HANA BGA reball stencil ( 0.6mm solder balls)*1
Griglia per reballing GPU CPU CSP CACHE HANA xbox360 ( 5 pz )
il Kit Comprende :
1 XBOX360/DDR3 Cache Heat Directly BGA reball stencil( 0.45mm solder balls)
1 XBOX 360 GPU Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 CPU Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 Southbridge Heat Directly BGA reball stencil( 0.6mm solder balls)
1 XBOX 360 HANA Heat Directly BGA reball stencil( 0.6mm solder balls)
ApprofondisciStencil per reballing GPU CPU CXR714120 Ps3 , non direct heat
il kit comprende :
PS3 GPU BGA reballing stencil ( 0.6mm solder balls)*1
PS3 CPU BGA reballing stencil ( 0.6mm solder balls) New *1
PS3 CPU BGA reballing stencil ( 0.6mm solder balls) Old *1
PS3 CXR714120( 0.6mm solder balls)*1
Stencil BGA per console PS3 ( 4 pezzi )
il Kit comprende :
1 PS3 GPU BGA reball stencil( 0.6mm solder balls)
1 PS3 CPU BGA reball stencil(0.6mm solder balls) New
1 PS3 CPU BGA reball stencil(0.6mm solder balls) Old
1 PS3 CXR714120(0.6mm solder balls)