QianLi ToolPlus BMW330 iPhone 7 Power Logic Module BGA

Stencil professionale di alta precisione.

QianLi ToolPlus S320 iPhone 7 Communication Base Band BGA

Stencil professionale di alta precisione.

Stencil per reballing scheda madre PS4 , kit composto da 2pz

1 PS4 CXD90026G 0.55MM

1 PS4 CDX90044GB 0.55MM

Stencil per reballing GPU CXD90044GB 0.55mm PS4 PRO

Stencil BGA per console PS3 ( 4 pezzi )

il Kit comprende :

1 PS3 GPU BGA reball stencil( 0.6mm solder balls)
1 PS3 CPU BGA reball stencil(0.6mm solder balls) New
1 PS3 CPU BGA reball stencil(0.6mm solder balls) Old
1 PS3 CXR714120(0.6mm solder balls)

Griglia per reballing GPU CPU CSP CACHE HANA xbox360 ( 5 pz )

il Kit Comprende :

1 XBOX360/DDR3 Cache Heat Directly BGA reball stencil( 0.45mm solder balls)

1 XBOX 360 GPU Heat Directly BGA reball stencil( 0.6mm solder balls)

1 XBOX 360 CPU Heat Directly BGA reball stencil(  0.6mm solder balls)

1 XBOX 360 Southbridge Heat Directly BGA reball stencil( 0.6mm solder balls)

1 XBOX 360 HANA Heat Directly BGA reball stencil( 0.6mm solder balls)

Stencil per reballing CPU Nintendo Switch

dimensioni 52x60mm

palline di stagno : 0.20mm

Stencil per reballing IC nintendo Switch

NFCBEA

BCM4354

MAX77620A

CYW20734UA

BGA200

MAX77812

Flussante Originale AMTECH NC-559-AS  , ottimo per Rework / Reflow su console.

Volume : 10cc

MADE IN USA

Confezione con lotto di produzione e data di scadenza.