Palline di stagno 0.2 mm per Reballing BGA
ApprofondisciStencil per reballing GPU CPU Hana DDR3 xbox 360 , non direct heat
il kit comprende :
XBOX360/DDR3 Cache BGA reball stencil ( 0.45mm solder balls)*1
XBOX 360 GPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 CPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 Southbridge BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 HANA BGA reball stencil ( 0.6mm solder balls)*1
Stencil per reballing GPU CPU CXR714120 Ps3 , non direct heat
il kit comprende :
PS3 GPU BGA reballing stencil ( 0.6mm solder balls)*1
PS3 CPU BGA reballing stencil ( 0.6mm solder balls) New *1
PS3 CPU BGA reballing stencil ( 0.6mm solder balls) Old *1
PS3 CXR714120( 0.6mm solder balls)*1