Stencil per reballing GPU CPU Hana DDR3 xbox 360 , non direct heat
il kit comprende :
XBOX360/DDR3 Cache BGA reball stencil ( 0.45mm solder balls)*1
XBOX 360 GPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 CPU BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 Southbridge BGA reball stencil ( 0.6mm solder balls)*1
XBOX 360 HANA BGA reball stencil ( 0.6mm solder balls)*1
South Bridge Stencil CXD90061G 0.5mm 90x90
ApprofondisciPalline di stagno 0.2 mm per Reballing BGA
Approfondisci